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Phased Manufacturing Programme

Implementation status of Phased Manufacturing Programme (PMP) for cellular mobile handsets and sub-assemblies/ parts thereof
Year Sub-Assembly
2016-17 (i) Charger/ Adapter, (ii) Battery Pack, (iii) Wired Headset - (Implemented: 15% BCD)
2017-18 (iv) Mechanics, (v) Die Cut Parts, (vi) Microphone and Receiver, (vii) Key Pad, (viii) USB Cable - (Implemented: 15% BCD)
2018-19 (ix) Printed Circuit Board Assembly (PCBA) - (Implemented: BCD increased to 20% w.e.f. 01.04.2020)

(x) Camera Module, (xi) Connectors - (Implemented: 10% BCD)
2019-20 (xii) Display Assembly, (xiii) Touch Panel/ Cover Glass Assembly - (BCD deferred till 30.09.2020. It will be 10% w.e.f. 01.10.2020)

(xiv) Vibrator Motor / Ringer - (Implemented: 10% BCD w.e.f. 01.04.2020)